Arrangement for generating a plasma by means of cathode sputteri

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

20419212, 20429808, 20429809, 20429819, C23C 1444

Patent

active

054178347

ABSTRACT:
The invention relates to an arrangement for generating a plasma by means of cathode sputtering. This arrangement comprises a magnetron and a target with shielding metal sheets. About these shielding metal sheets are wound two coils with a common center axis of which the one coil is connected to a dc power source and the other coil to a high-frequency source. Through the cooperation of the fields of both coils result helicon or whistler waves.

REFERENCES:
patent: 4990229 (1991-02-01), Campbell et al.
patent: 5126032 (1992-06-01), Szczyrbowski et al.
patent: 5277778 (1994-01-01), Daube et al.
patent: 5279669 (1994-01-01), Lee
Matsuo Yamashita: "Effect of magnetic field on plasma characteristics of built-in high-frequency coil type sputtering apparatus", J. Vac. Sci. Technol. A 7 (4), Jul./Aug. 1989, pp. 2752-2757.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Arrangement for generating a plasma by means of cathode sputteri does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement for generating a plasma by means of cathode sputteri, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement for generating a plasma by means of cathode sputteri will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2138004

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.