Arrangement for feeding or dissipating heat to/from a...

Radiant energy – Photocells; circuits and apparatus – With circuit for evaluating a web – strand – strip – or sheet

Reexamination Certificate

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C250S559300, C250S341800, C414S935000, C356S614000

Reexamination Certificate

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06969863

ABSTRACT:
The arrangement comprises a hot or cool plate (12) that has a substantially planar surface for accommodating the semiconductor substrate and for transmitting heat between the hot or cool plate and the semiconductor substrate, a source (10) of heat or cold that is connected to the hot or cool plate (12) for the purpose of heating or cooling, a device (25) for depositing or lifting the semiconductor substrate (8) onto/from the surface of the hot or cool plate (12). A light source (200) can be used to generate a focused light beam (80), preferably a laser beam, which is detected by a detector (100) with at least one sensor (110–140) after reflection by a wafer (8) deposited on the hot or cool plate (12). A control unit that is connected to the detector (100) for the purpose of evaluating a position of the reflected light beam determines a possible deposition error by comparing the position with one of a wafer (8) deposited with its entire surface on the hot or cool plate (12). A device (25) for depositing or lifting the semiconductor substrate is controlled in this case, the wafer being lifted and redeposited again.

REFERENCES:
patent: 5563798 (1996-10-01), Berken et al.
patent: 6274878 (2001-08-01), Li et al.
patent: 6624898 (2003-09-01), Chen
patent: 2002/0109111 (2002-08-01), Hall et al.
patent: 100 33 817 (2001-11-01), None

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