Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate
2010-04-29
2011-10-04
Clark, Sheila (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
Of specified material other than copper
C257S784000
Reexamination Certificate
active
08030744
ABSTRACT:
An electrical connection arrangement between a semiconductor circuit arrangement and an external contact device, and to a method for producing the connection arrangement is disclosed. In one embodiment, a metallic layer is deposited onto at least one contact terminal and/or the contacts and the wire, the metallic layer protecting the contact terminal or the electrical connection against ambient influences and ensuring a high reliability.
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Bellynck Gregory
Hosseini Khalil
Laska Thomas
Mahler Joachim
Stecher Matthias
Clark Sheila
Dicke Billig & Czaja, PLLC
Infineon - Technologies AG
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