Arrangement for electrically connecting semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper

Reexamination Certificate

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Details

C257S784000

Reexamination Certificate

active

08030744

ABSTRACT:
An electrical connection arrangement between a semiconductor circuit arrangement and an external contact device, and to a method for producing the connection arrangement is disclosed. In one embodiment, a metallic layer is deposited onto at least one contact terminal and/or the contacts and the wire, the metallic layer protecting the contact terminal or the electrical connection against ambient influences and ensuring a high reliability.

REFERENCES:
patent: 3864728 (1975-02-01), Peltz et al.
patent: 4000842 (1977-01-01), Burns
patent: 4736236 (1988-04-01), Butt
patent: 6255723 (2001-07-01), Light et al.
patent: 6512304 (2003-01-01), Ewer
patent: 6825564 (2004-11-01), Gleason et al.
patent: 7061949 (2006-06-01), Zhou et al.
patent: 7468560 (2008-12-01), Guengerich et al.
patent: 2002/0056901 (2002-05-01), Ono et al.
patent: 2002/0153615 (2002-10-01), Komiyama et al.
patent: 2003/0102563 (2003-06-01), Mercado et al.
patent: 2003/0173659 (2003-09-01), Lee et al.
patent: 2004/0217488 (2004-11-01), Luechinger
patent: 2005/0230850 (2005-10-01), Taggart et al.
patent: 2006/0186554 (2006-08-01), Otremba
patent: 69912565 (2004-09-01), None
patent: 2362510 (2001-11-01), None
patent: 54149578 (1979-11-01), None
patent: 55078536 (1980-06-01), None
patent: 62158338 (1987-07-01), None
patent: 62219628 (1987-09-01), None
patent: 63300522 (1988-07-01), None
patent: 01048434 (1989-02-01), None
patent: 02094452 (1990-04-01), None
patent: 04322435 (1992-11-01), None
patent: 06302639 (1994-10-01), None
patent: 11037022 (1999-02-01), None
patent: 2002222826 (2002-08-01), None

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