Arrangement for dissipating heat from power components assembled

Details Arrangement for dissipating heat from power components assembled Arrangement for dissipating heat from power components assembled

1994-01-28

1995-02-28

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174252, H05K 720

Patent

active

053943015

ABSTRACT:
An arrangement for dissipating heat from power components assembled on a printed-circuit board dissipates heat generated in the power components to the side of the printed-circuit board that is removed from the components. The printed-circuit board may have heat-transfer bore holes, and a heat-conducting material applied in the area of the power components, the heat-transfer bore holes, and the side of the printed-circuit board facing away from the power components. The side of the printed-circuit board that is removed from the power components may be coated with an insulating enamel and with a flexible heat-conducting enamel.

REFERENCES:
patent: 4628407 (1986-12-01), August et al.
patent: 4941067 (1990-07-01), Craft
patent: 4945451 (1990-07-01), Gahl et al.
patent: 5012387 (1991-04-01), Ohlenburger

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