Arrangement for decoupling integrated circuits electrically

Details Arrangement for decoupling integrated circuits electrically Arrangement for decoupling integrated circuits electrically

1988-10-03

1990-04-24

Jennings, Derek S.

Electricity: electrical systems and devices

Safety and protection of systems and devices

Load shunting by fault responsive means

361306, 174 524, 357 74, H08H 320

Patent

active

049204440

ABSTRACT:
An arrangement for electrically decoupling IC-circuits by means of decoupling capacitors. A particularly simple and effective electical decoupling of such circuits is achieved by mounting, e.g. gluing, a metal foil (2) on the circuit. The earth connection (3) of the circuit is connected to the edge of the foil through a short conductor and each of the signal output (4) and supply conductor (5) is connected directly to the foil edge through a respective soldered chip capacitor (7, 8).

REFERENCES:
patent: 4497105 (1985-02-01), Uemura
patent: 4598307 (1986-07-01), Wakabayashi et al.
patent: 4626958 (1986-12-01), Lockard et al.
patent: 4636918 (1987-01-01), Jodoin

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