Arrangement for cooling SMD power components on a printed...

Details Arrangement for cooling SMD power components on a printed... Arrangement for cooling SMD power components on a printed...

2007-04-26

2010-06-29

Pape, Zachary M (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C361S709000, C361S720000, C361S721000, C174S016300, C257S713000, C257S722000, C165S080300, C165S185000

Reexamination Certificate

active

07746650

ABSTRACT:
There is described an arrangement for cooling electrical components disposed on a board-shaped mounting substrate, particularly SMD power components on a printed circuit board, wherein at least one heat sink assigned to a component is present which is disposed on the same side as the components and which is connected in a thermally conductive manner to the assigned component by means of a thermally conductive layer implemented on the mounting substrate. The heat sink is implemented as a bent sheet-metal part and is connected to the thermally conductive layer by means of a solder joint, wherein the bent sheet-metal part has at least one heat sink element which extends in a longitudinal direction and said longitudinal direction is oriented obliquely to the plane of the board-shaped substrate.

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patent: 43 32 115 (2004-06-01), None

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