Arrangement for cooling electronic equipment by radiation transf

Details Arrangement for cooling electronic equipment by radiation transf Arrangement for cooling electronic equipment by radiation transf

1994-03-30

1995-10-10

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 174 151, 174 163, 361689, 361690, 361699, 361705, H05K 720

Patent

active

054576032

ABSTRACT:
An arrangement for cooling electronic equipment in a space by using radiation transfer, wherein the equipment includes heat-emitting electronic components mounted on a circuit board or the like. According to the invention, each circuit board or the like is surrounded by a cold plate which is spaced from the circuit board. The surfaces of both the circuit board and the plate are treated so as to have a high IR-radiation coefficient, wherein heat is transferred from the hot circuit board to the relatively colder plate by radiation.

REFERENCES:
patent: 3893307 (1975-07-01), Jacobs
patent: 4037270 (1977-07-01), Ahmann et al.
patent: 4564061 (1986-01-01), Rauth et al.
patent: 5088005 (1992-02-01), Ciaccio
Aichelmann, Jr. et al, "Three-Dimensional MLC Substrate Integrated Circuit Support Package" IBM Tech. Disc. Bulletin, vol. 20, No. 11A, Apr. 1978, 361/385, pp. 4349-4350.
IBM Technical Disclosure Bulletin, "Heat Exchanger Modules for Data Processor with Valves Operated by Pressure from Cooling Water Pump" vol. 30, p. 419 (Oct. 1987).
Patent Abstract of Japan, vol. 12, No. 207, abstract of JP 63-006864 (Jan. 12, 1988).

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