Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate
1999-12-31
2001-10-16
Tolin, Gerald (Department: 2835)
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
C029S890030, C165S104330, C257S714000, C361S719000
Reexamination Certificate
active
06304447
ABSTRACT:
FIELD OF THE INVENTION
The present invention relates generally to arrangements for cooling electronic assemblies, and more particularly, to arrangements for liquid-cooling such assemblies.
BACKGROUND OF THE INVENTION
Electronic assemblies which include a circuit board having a plurality of electronic components attached thereto are widely used in the communications industry to manage the flow of data on a telecommunications network. These electronic assemblies must be able to manage a high data rate over significant periods of time (e.g., months) without any maintenance. One problem encountered with these electronic assemblies, as well as other types of electronic assemblies, is that their high speed operations generate a significant amount of heat which can be detrimental to the electronic assemblies and thus cause maintenance problems. As a result, these electronic assemblies must be cooled constantly in order to maintain acceptable operating temperatures to avoid maintenance problems.
Several different approaches have been utilized in an attempt to address the aforementioned cooling requirement. For example, one approach employs assisted cooling techniques to maintain the electronic assembly within acceptable temperature limits. These assisted cooling techniques typically involve externally-powered cooling devices, such as fans. In a telecommunication central office switch, large fans are employed to provide the necessary cooling to the electronic assemblies. However, the use of assisted cooling techniques are discouraged by the communications industry because assisted cooling techniques can introduce a hazard to technicians working in the area. For example, the use of large fans can undesirably create a hazardous noise level. In addition, the types of fans used in assisted cooling tend to break down and thus increase the maintenance problems associated with servicing the telecommunications network.
Another approach utilizes a liquid to cool the electronic components attached to the circuit board. While liquid cooling improves the rate at which heat is dissipated from the various electronic devices, there is a need to improve the heat dissipation rates currently achievable without adding significant bulk to the overall assembly.
SUMMARY OF THE INVENTION
The present invention fulfills the above needs, as well as others, by providing an arrangement for cooling an electrical assembly that includes a circuit board at least partly disposed in a fluid tight compartment formed by an enclosure. The circuit board divides the compartment into first and second subcompartments. The circuit board includes at least one aperture through which liquid may flow from one subcompartment to another. The aperture allows liquid that has been heated from one or more electrical components in one subcompartment to flow to another compartment Such flow of the heated liquid increases the liquid's ability to dissipate the heat.
In one embodiment of the present invention, an arrangement for cooling an electronic assembly includes a circuit board and an enclosure member. The circuit board has a first surface, a second surface, and at least a first electronic component (or other heat-generating element) secured to the first surface. The enclosure member is secured to said circuit board so as to form a fluid tight barrier of a compartment defined at least in part by said enclosure member. Such compartment includes a first subcompartment defined at least in part by said first surface and said enclosure member and a second subcompartment defined at least in part by said second surface and said enclosure member. The circuit board further includes at least one aperture extending between the first surface and the second surface such that the first subcompartment is in fluid communication with the second subcompartment.
The aperture as used in the above arrangement allows for fluid flow between the first subcompartment and the second subcompartment. Thus, for example, if the first subcompartment includes more heat-generating components, such as the first electronic component, then the heat generated within the first subcompartment may be conveyed to the cooler second subcompartment via the liquid flow through the aperture.
The above described features and advantages, as well as others, will become more readily apparent to those of ordinary skill in the art by reference to the following detailed description and accompanying drawings.
REFERENCES:
patent: 4891688 (1990-01-01), Longerich
patent: 5390077 (1995-02-01), Paterson
patent: 5706668 (1998-01-01), Hilpert
patent: 5847927 (1998-12-01), Minning et al.
patent: 6052284 (2000-04-01), Suga et al.
patent: 1018623A (1966-01-01), None
Bortolini James R.
Farleigh Scott E.
Grimes Gary J.
Nyquist Jean S.
Sherman Charles J.
Lucent Technologies - Inc.
Maginot Addison & Moore
Tolin Gerald
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