Arrangement for coating substrates

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

20429807, 20429823, 20429825, 20429835, 118718, 118719, 118723E, 118729, C23C 1434

Patent

active

054239710

ABSTRACT:
The invention relates to an electrode configuration for a device for generating a plasma. RF is coupled contactlessly via a capacitive coupling electrode disposed at the dark space distance into a carrier backside of a coating installation. Dark space shields on the coating side define the plasma zone and prevent the formation of parasitic plasmas. HF substrate bias voltage on the moving substrate carrier is achieved with a defined plasma zone and the development of parasitic plasmas is avoided.

REFERENCES:
patent: 3461054 (1969-08-01), Vratny
patent: 3617459 (1971-11-01), Logan
patent: 3767551 (1973-10-01), Lang, Jr. et al.
patent: 3787312 (1974-01-01), Wagner et al.
patent: 4116806 (1978-09-01), Love et al.
patent: 4424101 (1984-01-01), Nowicki
patent: 4572842 (1986-02-01), Dietrich et al.
patent: 4719154 (1988-01-01), Hatwar
patent: 4728406 (1988-03-01), Banerjee et al.
patent: 4800174 (1989-01-01), Ishihara et al.
patent: 4803947 (1989-02-01), Ueki et al.
patent: 4851095 (1989-07-01), Scobey et al.
patent: 4874494 (1989-10-01), Ohmi
patent: 4920917 (1990-05-01), Nakatani et al.
patent: 4931169 (1990-06-01), Scherer et al.
patent: 5180434 (1993-01-01), DiDio et al.
patent: 5228968 (1993-07-01), Zejda
F. Vratny: Deposition of Tantalum and Tantalum Oxides by Superimposed RF and DC Sputtering, J. Electrochem. Soc., Vol. 114, No. 5 May 1967, pp. 505-508.
K. Kohler, J. W. Coburn, D. E. Horne, E. Kay: Plasma potential of 13.56 MHz rf argon glow discharges in a planary system, J. Appl. Phys, vol. 51 (1), Jan. 1985, pp. 59-66.
New mode of plasma deposition in a capacitively coupled reactor, T. Hamasaki et al, Appl. Phys. Lett. vol. 44 (11) 1 Jun. 1984, pp. 1049-1051.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Arrangement for coating substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Arrangement for coating substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement for coating substrates will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1307064

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.