Metal fusion bonding – With means to juxtapose and bond plural workpieces – Wire lead bonder
Patent
1979-08-24
1981-11-24
Weidenfeld, Gil
Metal fusion bonding
With means to juxtapose and bond plural workpieces
Wire lead bonder
29430, 198341, 198358, 198369, 228 6A, 228 47, H01L 2158
Patent
active
043019587
ABSTRACT:
A system for automatically fabricating and bonding semiconductor devices using lead frames and semiconductor chips, which comprises means for supplying a continuous strip of lead frames, an automatic die bonder for mounting semiconductor chips on the lead frames and forming sheets thereof, buffer means for temporarily storing the sheets formed of the lead frames and semiconductor chips mounted thereon, and at least one automatic wire bonder, all of these apparatuses being arranged in a line. The sheets are automatically and successively fed from the automatic die bonder to the buffer means and from the buffer means to the automatic wire bonder by means of a series of automatic conveyor mechanisms.
REFERENCES:
patent: 3444612 (1969-05-01), Pennings
patent: 3522942 (1970-08-01), Hepp
patent: 4027246 (1977-05-01), Caccoma et al.
patent: 4030622 (1977-06-01), Brooks et al.
patent: 4054238 (1977-10-01), Lloyd et al.
patent: 4144960 (1979-03-01), Schourtes
Herring, Sattler and Monahan Western Electric Technical Digest No. 36 Oct. 1974, pp. 17-18.
Hatakenaka Tatsuo
Nanbu Tetsuo
Tamaki Kiyouhei
Fujitsu Limited
Ramsey K. J.
Weidenfeld Gil
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