Patent
1989-09-08
1991-02-19
Lee, John D.
350 9620, 357 74, G02B 632
Patent
active
049937995
ABSTRACT:
An arrangement for the optical coupling of optical and/or opto-electronic components in free-beam technique includes a lens that is integrally formed with a semiconductor wafer. The semiconductor wafer simultaneously serves as an adjustable carrier. A planar Fresnel lens structure, Fresnel zone plate structure or holographic lens structure may be incorporated into the semiconductor wafer. The coupling arrangement of the invention is employed in light wave guide components and particularly laser modules.
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patent: 4057319 (1977-11-01), Ash et al.
patent: 4310216 (1982-01-01), Pellaux
patent: 4671603 (1987-06-01), McQuoid et al.
patent: 4775640 (1988-10-01), Chan
patent: 4875750 (1989-10-01), Spaeth et al.
Fresnel phase plate lenses for through-wafer optical interconnections, by Lawrence A. Hornak, Sep. 1, 1987 vol. 26, No. 17, Applied Optics, pp. 3649-3654.
Patent Abstracts of Japan P-591 Jul. 2, 1987, vol. 11 No. 203.
Lee John D.
Siemens Aktiengesellschaft
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