Wave transmission lines and networks – Coupling networks – With impedance matching
Reexamination Certificate
2006-09-26
2006-09-26
Jones, Stephen E. (Department: 2817)
Wave transmission lines and networks
Coupling networks
With impedance matching
C333S033000, C333S247000, C333S245000
Reexamination Certificate
active
07113054
ABSTRACT:
An arrangement and method for impedance matching (e.g., for a power amplifier) comprising a first node (204a) for receiving an output current to be impedance matched; a second node (212, 214) for receiving output current from the first node; a first current conductor (202c) for carrying current from the first node to the second node; a third node (204b) for receiving output current from the second node; and a second current conductor (202d) for carrying current from said second node to said third node, whereby the first and second current conductors are closely positioned so that their inductance is the sum of their self-inductances and the negative sum of their mutual inductance. The current conductors may be wire bonds, the arrangement may include a capacitor integrated in a power amplifier IC module, in which the capacitor may be provided in a separate IC from the power amplifier, the arrangement may utilise a plurality of impedance matching cells, and the wire bonds may be interdigitated across the semiconductor die. This provides the following advantages: easy to implement; increased accuracy of matching; requires few external components; easy to manufacture; no need for dedicated design flow; requires only standard IC production and test tools; uses low loss matching networks; involves only a small increase in die size (due to integration of capacitor), but the total size of the solution may be significantly reduced (e.g., by 50%) because of the reduced number of external components.
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PCT International Search Report (PCT/EP02/01040).
Montoriol Gilles
Riondet Phillipe
Trichet Jaques
Clingan James L.
Freescale Semiconductor Inc.
Jones Stephen E.
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