Fishing – trapping – and vermin destroying
Patent
1995-08-22
1998-02-10
Picardat, Kevin
Fishing, trapping, and vermin destroying
437 7, 148DIG162, H01L 2166
Patent
active
057168563
ABSTRACT:
An arrangement and method for detecting sequential processing effects on products to be manufactured in a manufacturing process orders a first set of the products in a first specified processing sequence for a first process step in the manufacturing process. In order to prevent any positional trend created at one process step from being carried over into the next process step, the first set of the products is re-ordered into a second, different specified processing sequence for a second process step in the manufacturing process. Data regarding responses of the first set of the products to the process steps are extracted. The extracted data are correlated with the first and second processing sequences and data analysis is performed on the correlated extracted data. These steps are repeated for subsequent sets of the products, so that although the specified processing sequence is different for each of the individual process steps for a set of products, the same processing sequences for the individual processing steps are used for subsequent sets of the products to be manufactured. Since the processing sequences are not randomized from set to set and do not have to be provided to a database, the amounts of interfacing and disk storage needed are greatly reduced.
REFERENCES:
patent: 5219765 (1993-06-01), Yoshida et al.
patent: 5240866 (1993-08-01), Friedman et al.
patent: 5464779 (1995-11-01), Fujimaki
patent: 5544350 (1996-08-01), Hung et al.
patent: 5581510 (1996-12-01), Furusho et al.
Dr. Gary M. Scher, "Wafer Tracking Comes of Age", Semiconductor International, May 1991, pp. 126-131.
Edwin Cervantes, "Automated Wafer Tracking in Workstream: Managing Automation Projects", 1992 Consilium International Users' Group Conference.
Proceedings of the Winter Simulation Conference--Designing Simulation Experiments: Taguchi Methods and Response Surface Metamodels; Dec. 8, 1991; John S. Ramberg et al.
Proceedings of the International Electronic Manufacturing Technology Symposium--Wire-Bonding Optimization Using Taguchi Method; Apr. 1, 1992; Xavier Saint-Martin et al.
Solid State Technology; vol. 31, No. 9--Identifying an Etch Process Window Using Response Surface Methodology; Sep. 1988; D.W. Daniel et al.
Proceedings of 1992 13th IEEE/CHMT IEMS--The Comparison of Response Surface and Taguchi Methods For Multiple-Response Optimization Using Simulation; Sep. 1992; Ken Jones et al.
Lin Yung-Tao
Ling Zhi-Min
Pak James
Shiau Ying
Advanced Micro Devices , Inc.
Picardat Kevin
LandOfFree
Arrangement and method for detecting sequential processing effec does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Arrangement and method for detecting sequential processing effec, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Arrangement and method for detecting sequential processing effec will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2076635