Arrangement and method for detecting sequential processing effec

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36446824, 36446828, 364489, 364490, 382226, 382228, 348128, 348598, 348 21, 348 6, 348 14, 348 46, C07C 268

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057610657

ABSTRACT:
An arrangement and method for detecting sequential processing effects on devices to be manufactured in a manufacturing process extracts data regarding responses of the devices to a process step in the manufacturing process and data regarding a processing sequence of the devices in that process step. The extracted data is refined before analysis and control chart rules are then applied to the refined data. These control chart rules detect whether there are any unusual processing effects caused by the sequence of processing of the devices in any one of the individual processing steps. Application of control chart rules to the refined data allows an automatic determination of whether there are any rule violations. One or more control charts which have a rule violation are automatically generated when it is determined that there is a rule violation. Process engineers may then use the automatically generated charts to direct their efforts at improving the manufacturing process.

REFERENCES:
patent: 5226118 (1993-07-01), Baker et al.
patent: 5450326 (1995-09-01), Black
"Wafer Tracking of Age" by Dr. Gary M. Scher, Semiconductor International, May 1991, pp. 126-131.
"Optimizing Polysilicon Deposition on Thin Oxides" by John Franka et al., Semiconductor International, May 1991, pp. 194-197.
"In-Line Statistical Process Control and Feedback for VLSI Integrated Circuit Manufacturing" by Gary Scher et al., IEEE Transactions on Components and Manufacturing Technology, vol. 13, No. 3, Sep. 1990, pp. 484-489.
"Using Wafer Level Tracking for Problem Solving and Process Improvement" Gary Scher et al.

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