Arrangement and method for current density control in electropla

Chemistry: electrical and wave energy – Processes and products

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204273, 204DIG7, C25D 502, C25D 2110

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active

045348324

ABSTRACT:
A circuit board having a foil bonded to it and connected to serve as a cathode, faces an anode with an interposed shield of sections each of a plurality of horizontally disposed slats. The slats are uniformly spaced center to center, but upper sections of slats have a larger width in the vertical direction than slats of successively lower sections, so that the anode is more exposed in line-of-sight to the upper portions of the cathode foil than the lower sections. Therefore, in plating there is some compensation for the variation in voltage which occurs due to current flow from the upper connection of the cathode foil to the negative terminal. A sparger tube vertically oriented supports the slats. The tube is apertured between each slat and the apertures face the cathode. Electrolyte forced through the sparger tube and then through its openings serves to provide solution agitation for the cathode. Interposing the shield between the anode and the foil cathode so that relatively smaller spaces are provided to expose direct paths from anode to the parts of the cathode nearer the negative terminal and relatively larger in the direct paths from the anode to the parts more remote from the negative terminal, tend to compensate for voltage drop across the cathode due to current flow.

REFERENCES:
patent: 2559926 (1951-07-01), Beebe
patent: 3743583 (1973-07-01), Castonguay
patent: 3809642 (1974-05-01), Bond
patent: 3962047 (1976-06-01), Wagner
patent: 4304641 (1981-12-01), Grandia
patent: 4378281 (1983-03-01), Scanlon
patent: 4378282 (1983-03-01), Martin

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