Arrangement and method for cooling a power semiconductor

Details Arrangement and method for cooling a power semiconductor Arrangement and method for cooling a power semiconductor

2008-09-09

2008-09-09

Thompson, Gregory D (Department: 2835)

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

C165S080200, C165S080300, C165S185000, C361S704000, C361S760000, C257S713000

Reexamination Certificate

active

11358514

ABSTRACT:
In an arrangement and a method for cooling a power semiconductor in which at least one power semiconductor is electrically and thermally conductively connected to at least one passive electric component. Further, a cooling element is thermally conductively connected to at least a part of the surface of the passive electrical component and/or the electrically and thermally conductive connection.

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