Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1986-01-06
1987-05-12
Page, Thurman K.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 40, 427307, 427308, B05D 306
Patent
active
046649360
ABSTRACT:
The resin-impregnated composite prepreg based on a fabric material of an aromatic polyamide fiber is prepared by exposing the fabric material to low temperature plasma generated in an atmosphere of an inorganic gas, which is preferably oxygen or an oxygen-containing gaseous mixture, under a pressure of 0.5 to 5 Torr to such an extent that ruggedness of 0.01 to 0.5 .mu.m is formed on the surface and then impregnating the fabric material with an organic resinous binder. The adhesive bonding strength between the binder and the fiber surface can further be increased when the plasma-treated fabric material is brought into contact with an unsaturated compound polymerizable by free radical polymerization without contacting with air so as to form a graft-polymerized layer on the fiber surface.
REFERENCES:
patent: 4064030 (1977-12-01), Nakai et al.
patent: 4400424 (1983-08-01), Hatada et al.
patent: 4504349 (1985-03-01), Ueno et al.
M. R. Wertheimer and H. P. Hchreiber, Surface Property Modification of Aromatic Polyamides by Microwave Plasmas, J. Appl. Polym. Sci., 26 2087-96 (1981).
Hoshida Shigehiro
Nomura Hirokazu
Ueno Susumu
Page Thurman K.
Shin-Etsu Chemical Co. , Ltd.
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