Area-selective metallization process

Details Area-selective metallization process Area-selective metallization process

1990-01-02

1992-07-07

Niebling, John F.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C25D 502, C25D 550, C25D 500

Patent

active

051279983

ABSTRACT:
Selective electrolytic deposition on either conductive or non-conductive bodies is provided by forming a layer of a metal which forms a plating-preventing compound on the surface of the body to be plated, and selectively interdiffusing a plating-enabling metal into the surface of that compound-forming metal in those locations where plating is desired and electroplating the body. The interdiffusion may be done before or after the plating-preventing compound has formed on the surface of the compound-forming layer. During the electroplating, the electroplating metal deposits only in those locations where the plating-enabling metal has interdiffused with the compound-forming metal. At the end of the process, the compound-forming metal may be removed in those locations where it is not covered by the electroplated metal to provide a plurality of separate plated conductors.

REFERENCES:
patent: 3505181 (1970-04-01), Marshall
patent: 3708403 (1973-01-01), Kogar et al.
patent: 4092448 (1978-05-01), Coll-Palagos
patent: 4236940 (1980-12-01), Manty et al.
patent: 4434544 (1984-03-01), Dohy a et al.
patent: 4786523 (1988-11-01), Dohya

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