Area bonding conductive adhesive preforms

Details Area bonding conductive adhesive preforms Area bonding conductive adhesive preforms

1994-04-12

1997-09-16

Le, H. Thi

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Including a second component containing structurally defined...

156 47, 156320, 156330, 428328, 428343, 428356, 428355EP, B32B 516

Patent

active

056678843

ABSTRACT:
Electrically conductive sheet material preforms useful in bonding of electronic components as well as in the formation of electronic circuits are disclosed. The preforms, which comprise a multiplicity of electrically conductive adhesive members, each being separated from each other by means of a non-electrically conductive adhesive, are particularly useful in the assembly of multi-chip modules and other electronic devices.

REFERENCES:
patent: 4012832 (1977-03-01), Crane
patent: 5136365 (1992-08-01), Pennisi
patent: 5147210 (1992-09-01), Patterson et al.
patent: 5187020 (1993-02-01), Kwon
patent: 5201974 (1993-04-01), West
patent: 5252255 (1993-10-01), Moy et al.

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