Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Patent
1990-08-24
1991-07-09
Bradley, Paula A.
Electrical connectors
Preformed panel circuit arrangement, e.g., pcb, icm, dip,...
With provision to conduct electricity from panel circuit to...
439840, 439841, H01R 909
Patent
active
050301098
ABSTRACT:
An area array connector (10) for electrically interconnecting circuit pads (18,20) on spaced apart, substrates (22,24) is disclosed. The connector (10) includes a carrier plate (12) having canted coil spring contacts (16) positioned in openings (14) for electrically interconnecting corresponding circuit pads (18,20) on the respective substrates (22,24) between which the connector (10) is placed.
REFERENCES:
patent: 2153177 (1939-04-01), Ecker
patent: 3513434 (1970-05-01), Zielke
patent: 4029375 (1977-06-01), Gabrielian
patent: 4810213 (1989-03-01), Chabot
patent: 4820376 (1989-04-01), Lambert et al.
patent: 4838815 (1989-06-01), Tajuma et al.
AMP Incorporated
Bradley Paula A.
Osborne Allan B.
LandOfFree
Area array connector for substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Area array connector for substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Area array connector for substrates will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-614737