Arcuate profiled heatsink apparatus and method

Heat exchange – With retainer for removable article – Electrical component

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Details

165 802, 165185, 361386, H01L 2340

Patent

active

051727552

ABSTRACT:
An arcuate profiled heatsink is disclosed, over which is flexed and attached a substrate on which are mounted heat producing, temperature sensitive electronic devices. Flexing the substrate to conform with the arcuate surface of the heatsink minimizes air pockets between the two, which would ordinarily result due to warpage resulting from the fabrication of the substrate. The interface between heatsink and substrate, therefore, has lower thermal resistance, thus, increasing thermal conductivity between heatsink and substrate, and increasing the amount of heat dissipated by the heatsink. Because no hard joining of the two parts is required, they may be separated for repair, and stress resulting from thermal expansion mismatch will not be transferred to the substrate.

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Steel Plate Engineering Data--vol. 2: Useful Information on the Design of Plate Structures, published by the Commitee of Steel Plate Producers, American Iron and Steel Institute, 1000 16th Street, N.W., Washington, D.C. 20036, Jun. 1985, p. 5, Table 1B, under the title "Stress and Deflection Coefficients-Rectangle".

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