Architecture for power modules such as power inverters

Electric power conversion systems – Current conversion – Encased in plug housing

Reexamination Certificate

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C363S144000, C307S147000, C307S112000

Reexamination Certificate

active

11010560

ABSTRACT:
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

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