Architecture for power modules such as power inverters

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices

Reexamination Certificate

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Reexamination Certificate

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11010950

ABSTRACT:
Power converters such as power modules configured as inverters employ modularized approaches. In some aspects, semiconductor devices are thermally coupled directly to thermally conductive substrates without intervening dielectric or insulative structures. Additionally, or alternatively, semiconductor devices are thermally coupled to thermally conductive substrates with relatively large surface areas before heat transferred from the semiconductor devices encounters a dielectric or electrically insulating structure with correspondingly high thermal impedance.

REFERENCES:
patent: 4772999 (1988-09-01), Fiorina et al.
patent: 5350894 (1994-09-01), Allison
patent: 5737053 (1998-04-01), Yomogihara et al.
patent: 6181590 (2001-01-01), Yamane et al.
patent: 6327165 (2001-12-01), Yamane et al.
patent: 6603672 (2003-08-01), Deng et al.
patent: 6636429 (2003-10-01), Maly et al.
patent: 6793502 (2004-09-01), Parkhill et al.
patent: 6822850 (2004-11-01), Pfeifer et al.
patent: 6843335 (2005-01-01), Shirakawa et al.
patent: 6845017 (2005-01-01), Ahmed et al.
patent: 6861764 (2005-03-01), Sato et al.
patent: 6888729 (2005-05-01), Maekawa et al.
patent: 2002/0034088 (2002-03-01), Parkhill et al.
patent: 2002/0167828 (2002-11-01), Parkhill et al.
patent: 2003/0175576 (2003-09-01), Ohtani et al.
patent: 2005/0152100 (2005-07-01), Rodriguez et al.
patent: 2005/0152101 (2005-07-01), Rodriguez et al.
patent: 2005/0162875 (2005-07-01), Rodriguez et al.
U.S. Appl. No. 10/738,926, filed Dec. 16, 2003, Maly et al.
U.S. Appl. No. 60/233,992, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/233,993, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/233,994, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/233,995, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/233,996, filed Sep. 20, 2000, Parkhill et al.
U.S. Appl. No. 60/471,387, filed May 16, 2003, Flett et al.

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