Architecture for face-to-face bonding between substrate and...

Details Architecture for face-to-face bonding between substrate and... Architecture for face-to-face bonding between substrate and...

2008-04-15

2008-04-15

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

Reexamination Certificate

active

11171488

ABSTRACT:
An integrated circuit system includes a first integrated circuit die and a family of second integrated circuit dice. The first integrated circuit die have input/output circuits disposed thereon and further have a first array of face-to-face bonding structures disposed on a first face thereof. Each member of the family of second integrated circuit dice have logical function circuits disposed thereon and further have a second array of face-to-face bonding structures disposed on a first face thereof. The second array of face-to-face bonding structures of each member of the family mates with a different portion of the first array of face-to-face bonding structures.

REFERENCES:
patent: 6255729 (2001-07-01), Oikawa
patent: 6914259 (2005-07-01), Sakiyama et al.
patent: 7242093 (2007-07-01), Ueda
patent: 2001/0040281 (2001-11-01), Butler
patent: 2002/0004932 (2002-01-01), Shau
patent: 2002/0008309 (2002-01-01), Akiyama
patent: 2002/0017718 (2002-02-01), Hikita et al.
patent: 2005/0205983 (2005-09-01), Origasa et al.
patent: 2005/0224942 (2005-10-01), Ho
patent: 2006/0038273 (2006-02-01), Lu et al.
patent: 2006/0071332 (2006-04-01), Speers
patent: 2006/0237833 (2006-10-01), Klein et al.
patent: 2006039254 (2006-04-01), None
patent: 2006039254 (2006-04-01), None
Anonymous, “3D Integration for Mixed Signal Applications,” Ziptronix, Inc., 4 pages, 2002, no month.
Anonymous, “Benefits of 3D Integration in Digital Imaging Applications,” Ziptronix, Inc., 3 pages, 2002, no month.
T. Makimoto, Ph. D., “New Opportunities in the Chip Industry,” Semico Summit 2004, Scottsdale, Arizona, 40 pages, Mar. 14-16, 2004.

Affiliated with

Also associated with

Rating

Architecture for face-to-face bonding between substrate and... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Architecture for face-to-face bonding between substrate and..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Architecture for face-to-face bonding between substrate and... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3953451