Architecture for face-to-face bonding between substrate and...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings

Reexamination Certificate

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Reexamination Certificate

active

07358601

ABSTRACT:
An integrated circuit system includes a first integrated circuit die and a family of second integrated circuit dice. The first integrated circuit die have input/output circuits disposed thereon and further have a first array of face-to-face bonding structures disposed on a first face thereof. Each member of the family of second integrated circuit dice have logical function circuits disposed thereon and further have a second array of face-to-face bonding structures disposed on a first face thereof. The second array of face-to-face bonding structures of each member of the family mates with a different portion of the first array of face-to-face bonding structures.

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patent: 2006039254 (2006-04-01), None
patent: 2006039254 (2006-04-01), None
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T. Makimoto, Ph. D., “New Opportunities in the Chip Industry,” Semico Summit 2004, Scottsdale, Arizona, 40 pages, Mar. 14-16, 2004.

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