Architecture and method of fabrication for a liquid metal...

Electricity: circuit makers and breakers – Liquid contact

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C200S191000, C200S228000

Reexamination Certificate

active

07358452

ABSTRACT:
A switch comprises a first wafer having a thin-film structure defined thereon, a second wafer having a plurality of features defined therein, and a seal between the first wafer and the second wafer forming a two-wafer structure having a liquid metal microswitch defined therebetween.

REFERENCES:
patent: 6323447 (2001-11-01), Kondoh et al.
patent: 6559420 (2003-05-01), Zarev
patent: 6689976 (2004-02-01), Dove et al.
patent: 6743991 (2004-06-01), Wong et al.
patent: 6777630 (2004-08-01), Dove et al.
patent: 6822176 (2004-11-01), Fazzio
patent: 6866520 (2005-03-01), Chiang
patent: 6927350 (2005-08-01), Kondoh et al.
patent: 7030328 (2006-04-01), Beerling
patent: 1235238 (2002-08-01), None
patent: 1235242 (2002-08-01), None
patent: 2006/093587 (2006-08-01), None
European Patent Office, Search Report, Dec. 5, 2007.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Architecture and method of fabrication for a liquid metal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Architecture and method of fabrication for a liquid metal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Architecture and method of fabrication for a liquid metal... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2762880

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.