ARC gap for integrated circuits

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357 51, 357 54, 357 55, 357 68, 357 85, H01L 2978, H01L 2702, H01L 2934, H01L 2906

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047944374

ABSTRACT:
An arc gap for an integrated circuit on a surface of a substrate of semiconductor material includes a first conductive strip over and insulated from the substrate surface. A layer of an insulating material is over the first conductive strip and a second conductive strip is on the insulating layer. The insulating layer has an opening therethrough which exposes at least a portion of the first conductive strip. The second conductive strip extends to substantially the edge of the opening in the insulating layer so that the two conductive strips are exposed to each other through the opening. The two conductive strips may be portions of a metallization pattern for the integrated circuit.

REFERENCES:
patent: 4252840 (1981-02-01), Minami
patent: 4364078 (1982-12-01), Smith et al.
S. H. Cohen et al., "An Improved Input Protection Circuit for C-MOS/SOS Arrays", IEEE Transactions on Electron Devices, vol. ED-25 (Aug. 1978) pp. 926-932.
R. E. Thun, "Deposited, Noise-Reducing Ground Plane", IBM Technical Disclosure Bulletin, vol. 10 (Jun. 1967) p. 87.

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