Aqueous stripping and cleaning composition

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – Specific organic component

Reexamination Certificate

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Details

C510S175000, C510S176000, C510S461000, C510S492000, C510S493000

Reexamination Certificate

active

06943142

ABSTRACT:
The present invention relates to aqueous compositions used to remove post etch organic and inorganic residue as well polymeric residues and contaminants from semiconductor substrates. The compositions are comprised of a water soluble organic solvent, a sulfonic acid and water.

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