Aqueous solution for removing post-etch residue

Details Aqueous solution for removing post-etch residue Aqueous solution for removing post-etch residue

2011-04-05

2011-04-05

Webb, Gregory E (Department: 1796)

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

C252S079100

Reexamination Certificate

active

07919445

ABSTRACT:
The present invention relates to a novel solution for the removal of post-etch residues having improved properties and to the use thereof in the production of semiconductors. The invention relates, in particular, to an aqueous solution having a reduced etching rate on metallisations and on surfaces which have to be freed from post-etch residues and particles during the semiconductor production process.

REFERENCES:
patent: 6156661 (2000-12-01), Small
patent: 6199567 (2001-03-01), Kanno et al.
patent: 6200947 (2001-03-01), Takashima et al.
patent: 6361407 (2002-03-01), Lu et al.
patent: 6391794 (2002-05-01), Chen et al.
patent: 6417112 (2002-07-01), Peyne et al.
patent: 6530968 (2003-03-01), Tsuchiya et al.
patent: 2002/0048953 (2002-04-01), Nayak
patent: 2003/0004085 (2003-01-01), Ando et al.
patent: 2003/0143857 (2003-07-01), Andreas
patent: 2004/0053800 (2004-03-01), Zhang et al.
patent: 2004/0167047 (2004-08-01), Ishikawa et al.
patent: 2005/0181609 (2005-08-01), Kurata et al.
patent: 2005/0205835 (2005-09-01), Tamboli et al.
patent: 2006/0042502 (2006-03-01), Sato et al.
patent: 2007/0235061 (2007-10-01), Mizuta et al.
patent: 41 40 181 (1993-06-01), None
patent: 0 068 277 (1983-01-01), None
patent: 0 485 161 (1992-05-01), None
patent: 0 896 042 (1999-02-01), None
patent: 1 024 521 (2000-08-01), None
patent: 1 063 689 (2000-12-01), None
patent: 1 139 401 (2001-10-01), None
patent: 11-233405 (1999-08-01), None
patent: 2000-273663 (2000-10-01), None
patent: 2001-7071 (2001-01-01), None
patent: 2001-26890 (2001-01-01), None
patent: 2001-523356 (2001-11-01), None
patent: 2003-257922 (2003-09-01), None
patent: 2003-316029 (2003-11-01), None
patent: WO 98/50516 (1998-11-01), None
patent: WO 99/63404 (1999-12-01), None

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