Aqueous solution for activation accelerating treatment

Details Aqueous solution for activation accelerating treatment Aqueous solution for activation accelerating treatment

1992-11-18

1993-10-19

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

C23C 1818

Patent

active

052541568

ABSTRACT:
An aqueous solution comprising sulfuric acid, cupric chloride and, if necessary, an organic acid is effective as an activation accelerating treatment for electroless palting for improving electroless plating in through-holes and for improving adhesive strength between a copper foil and an electrolessly plated copper.

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patent: 4540464 (1985-09-01), Mueller et al.
patent: 4666739 (1987-05-01), Roubal
patent: 4863758 (1989-09-01), Rhodenizer
Grant & Hackh's Chemical Dictionary, 5th Ed. 1988, p. 563.

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