Aqueous silica compositions for polishing silicon wafers

Details Aqueous silica compositions for polishing silicon wafers Aqueous silica compositions for polishing silicon wafers

1985-05-20

1986-05-13

Schmidt, Frederick R.

Abrasive tool making process, material, or composition

With inorganic material

Clay, silica, or silicate

51283R, B24B 100

Patent

active

045884218

ABSTRACT:
A composition useful in polishing silicon wafers and like materials which comprises an aqueous colloidal silica sol or gel and from 0.1-5% by weight based on the SiO.sub.2 content of the sol or gel of piperazine.

REFERENCES:
patent: 3170273 (1965-02-01), Walsh et al.
patent: 3715842 (1973-02-01), Tredinnick et al.
patent: 3877183 (1975-04-01), Deckert et al.
patent: 3922393 (1975-11-01), Sears, Jr.
patent: 4057939 (1977-11-01), Basi
patent: 4169337 (1979-10-01), Payne
patent: 4462188 (1984-07-01), Payne

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