Aqueous polishing liquid and chemical mechanical polishing...

Details Aqueous polishing liquid and chemical mechanical polishing... Aqueous polishing liquid and chemical mechanical polishing...

2011-03-15

2011-03-15

Vinh, Lan (Department: 1713)

Compositions

Etching or brightening compositions

C252S079200, C438S692000, C216S089000

Reexamination Certificate

active

07906038

ABSTRACT:
An aqueous polishing liquid is provided that includes an oxidizing agent, a five-membered monocyclic compound having at least three nitrogen atoms or a compound in which a hetero ring is fused to said compound, and a compound having an imidazole skeleton or an isothiazolin-3-one skeleton. The five-membered monocyclic compound having at least three nitrogen atoms and/or the compound in which a hetero ring is fused to said compound is used at a total concentration of less than 300 mg/L, and the compound having an imidazole skeleton or an isothiazolin-3-one skeleton is used at a concentration of at least 10 mg/L but no greater than 500 mg/L. There is also provided a chemical mechanical polishing method that includes a step of polishing by making a surface to be polished and a polishing surface move relative to each other while being in contact with each other in the presence of the aqueous polishing liquid.

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F. B. Kaufman et al., “Chemical-Mechanical Polishing for Fabricating Patterned W Metal Features as Chip Interconnects” (1991) J. Electrochem. Soc., vol. 138, No. 11, pp. 3460-3465.
Seiichi Kondo et al., “Abrasive-Free Polishing for Copper Damascene Interconnection” (2000) Journal of the Electrochemical Society, vol. 147, No. 10, pp. 3907-3913.

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