Cleaning and liquid contact with solids – Processes – For metallic – siliceous – or calcareous basework – including...
Reexamination Certificate
2008-07-15
2008-07-15
Barr, Michael (Department: 1792)
Cleaning and liquid contact with solids
Processes
For metallic, siliceous, or calcareous basework, including...
C134S003000, C134S026000, C134S028000, C510S175000, C510S176000
Reexamination Certificate
active
10826319
ABSTRACT:
The present invention relates to dilute fluoride solutions and methods for cleaning plasma etch residue from semiconductor substrates including such dilute solutions. The compositions and methods according to the invention can advantageously provide both cleaning efficiency and material compatibility.
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Aoyama Tetsuo
Hiraga Toshitaka
Suzuki Tomoko
Barr Michael
EKC Technology, Inc.
Morgan & Lewis & Bockius, LLP
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