Aqueous electroless nickel plating bath and process

Details Aqueous electroless nickel plating bath and process Aqueous electroless nickel plating bath and process

1984-03-05

1984-11-20

Hayes, Lorenzo B.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 125, 427438, 4274431, C23C 302

Patent

active

044837119

ABSTRACT:
An improved aqueous electroless nickel plating bath and process for chemically depositing nickel on a substrate comprising an aqueous solution containing nickel ions, hypophosphite ions, a complexing agent, preferably a buffering agent and a wetting agent, and a small but effective amount of a sulfonium betaine compound sufficient to control the rate of nickel deposition and the concentration of phosphorus in the nickel deposit, preferably, in further combination with supplemental organic and/or inorganic rate stabilizers. The invention further contemplates a process for rejuvenating an electroless nickel bath which has been rendered inoperative due to the presence of excessive concentrations of supplemental stabilizing agents by the addition of a controlled effective amount of a sulfonium betaine compound sufficient to restore the bath to an operative plating condition.

REFERENCES:
patent: 2762723 (1956-09-01), Talmey et al.
patent: 2822293 (1958-02-01), Gutzeit et al.
patent: 2937978 (1960-05-01), Strauss et al.
patent: 3489576 (1970-01-01), Vincent et al.

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