Compositions – Heat-exchange – low-freezing or pour point – or high boiling... – Organic components
Patent
1982-01-21
1984-08-28
Kittle, John E.
Compositions
Heat-exchange, low-freezing or pour point, or high boiling...
Organic components
252 334, 252 495, 252 77, C10M 110, C10M 116, C10M 132, C10M 304
Patent
active
044683391
ABSTRACT:
An aqueous composition comprising: (A) water; (B) an overbased material dispersed with component (A), said overbased material being selected from the group consisting of (B)(I) a Newtonian overbased material or (B)(II) a non-Newtonian colloidal disperse system comprising (1) solid metal-containing colloidal particles predispersed in (2) a disperse medium of at least one inert organic liquid and (3) as an essential third component at least one member selected from the class consisting of organic compounds which are substantially soluble in said disperse medium, the molecules of said organic compound being characterized by polar substituents and hydrophobic portions; and an effective amount of at least one additional component to disperse component (B) with component (A), said additional component being selected from the group consisting of (C) at least one nitrogen-containing, phosphorus-free carboxylic solubilizer made by the reaction of (C)(I) at least one carboxylic acid acylating agent having at least one hydrocarbon-based substituent of about 12 to about 500 carbon atoms which (C)(II) at least one (a) N-(hydroxyl-substituted hydrocarbyl) amine, (b) hydroxyl-substituted poly(hydrocarbyloxy) analog of said amine or (c) mixture of (a) and (b), (D) at least one surfactant, or (E) mixture of (C) and (D). The foregoing aqueous compositions are optionally provided in combination with (F) a functional additive and/or (G) a dispersion enhancer selected from the group consisting of polyhydroxy compounds and partial ethers of polyhydroxy compounds. A method for cutting hard materials such as quartz, silicon and the like utilizing the foregoing compositions, as well as abrasive slurries for said cutting method and for conventional lapping applications and for metal working or polishing applications is provided.
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Forsberg John W.
Rysek Joseph J.
Danison Walter C.
Keller Raymond F.
Kittle John E.
Polyn Denis A.
The Lubrizol Corporation
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