Aqueous cleaning solution and method for removing uncured adhesi

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

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510175, 510202, 510203, 510206, 510212, 510243, 510245, 510365, 510490, 510500, C11D 328, C11D 333, C11D 1825

Patent

active

060178639

ABSTRACT:
An alkaline, aqueous cleaning solution which is capable of removing at least a substantial portion of uncured adhesive residues, e.g., epoxy-based adhesives, from a substrate, preferably a metal stencil substrate, contains water, an alkalinity-providing agent and a synergistic combination of surfactants, specifically an N-alkylpyrrolidone surfactant, which is preferably N-octyl-2-pyrrolidone, and an aminocarboxylic acid surfactant, which is preferably N-coco-beta-aminopropionic acid. At an active-concentration ratio of the N-alkyl-2-pyrrolidone surfactant to the aminocarboxylic acid surfactant of from about 1:1 to about 3.5:1 and a total active concentration of at least 0.30% by weight of the aqueous cleaning solution, the N-alkyl-2-pyrrolidone and aminocarboxylic acid surfactants synergistically improve the ability of the solution to remove uncured adhesive residues from the substrate, even at relatively low wash temperatures, e.g., from about 70.degree. F. to less than about 135.degree. F.

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