Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2008-03-14
2011-11-29
Pyon, Harold (Department: 1761)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S405000, C510S500000
Reexamination Certificate
active
08067352
ABSTRACT:
The invention relates to an aqueous cleaning composition for use in a cleaning process during or after a chemical mechanical planarization for a copper integrated circuit processing, comprising 0.05 to 20 wt % of a nitrogen-containing heterocyclic organic base, 0.05 to 50 wt % of an alcohol amine, 0.01-10 wt % of a quaternary ammonium hydroxide, and water. When used during or after the planarization process, the inventive cleaning composition of the invention can effectively remove residual contaminants from the surfaces of the wafers and simultaneously maintain a good surface roughness of the wafers.
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Chen Chien Ching
Chen Jui Ching
Chuang Tsung Hsien
Liu Wen Cheng
Chiang Timothy
Epoch Material Co., Ltd.
Onholt Thomas E.
Pyon Harold
Weseman Steven D.
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