Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2008-04-29
2008-04-29
Boyer, Charles I (Department: 1796)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S175000, C510S176000, C510S181000, C510S504000
Reexamination Certificate
active
11094113
ABSTRACT:
A cleaning solution is provided for cleaning metal-containing microelectronic substrates, particularly for post etch, via formation and post CMP cleaning. The cleaning solution consists of a quaternary ammonium hydroxide, an organic amine, and water. A preferred cleaning solution consists of tetramethylammonium hydroxide, monoethanolamine, and water. The pH of cleaning solution is greater than 10.
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Int'l Search Report for PCT/US2006/007676 dated Jul. 12, 2006.
Barnes Jeffrey A.
Naghshineh Shahriar
Walker Elizabeth L.
Yanders Kevin P.
Advanced Tehnology Materials, Inc.
Boyer Charles I
Fuierer Tristan A.
Lin Chih-Sheng (Jason)
Moore & Van Allen PLLC
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