Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2008-04-29
2008-04-29
Boyer, Charles I (Department: 1796)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S175000, C510S176000, C510S181000, C510S504000
Reexamination Certificate
active
07365045
ABSTRACT:
A cleaning solution is provided for cleaning metal-containing microelectronic substrates, particularly for post etch, via formation and post CMP cleaning. The cleaning solution consists of a quaternary ammonium hydroxide, an organic amine, and water. A preferred cleaning solution consists of tetramethylammonium hydroxide, monoethanolamine, and water. The pH of cleaning solution is greater than 10.
REFERENCES:
patent: 4808513 (1989-02-01), Lazarus et al.
patent: 5143648 (1992-09-01), Satoh et al.
patent: 5466389 (1995-11-01), Ilardi et al.
patent: 5563119 (1996-10-01), Ward
patent: 5597420 (1997-01-01), Ward
patent: 5709756 (1998-01-01), Ward
patent: 5863344 (1999-01-01), Nam
patent: 6194366 (2001-02-01), Naghshineh et al.
patent: 6417147 (2002-07-01), Amemiya et al.
patent: 6492308 (2002-12-01), Naghshineh et al.
patent: 2004/0220065 (2004-11-01), Hsu
patent: 2006/0016785 (2006-01-01), Egbe et al.
patent: 2006/0166847 (2006-07-01), Walker et al.
patent: 2007/0111912 (2007-05-01), Phenis et al.
patent: 0 647 884 (1995-04-01), None
patent: 02/065538 (2002-08-01), None
patent: WO 02/065538 (2002-08-01), None
Int'l Search Report for PCT/US2006/007676 dated Jul. 12, 2006.
Barnes Jeffrey A.
Naghshineh Shahriar
Walker Elizabeth L.
Yanders Kevin P.
Advanced Tehnology Materials, Inc.
Boyer Charles I
Fuierer Tristan A.
Lin Chih-Sheng (Jason)
Moore & Van Allen PLLC
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