Aqueous cleaner for removing solder pastes

Details Aqueous cleaner for removing solder pastes Aqueous cleaner for removing solder pastes

1996-09-24

1998-10-13

Hertzog, Ardith

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

510255, 510258, 510422, 510423, 510434, 510435, 510437, 510476, 510491, 510506, 510509, 510511, C11D 1825, C11D 308, C11D 310

Patent

active

058212086

ABSTRACT:
Printing applicators such as metal stencils and screens used to apply solder paste to printed circuit boards are cleaned to remove accumulated solder paste therefrom by an aqueous alkaline salt cleaner. The aqueous cleaner of the present invention comprises alkaline salts such as alkali metal carbonates, a surfactant formulation which contains at least one nonionic surfactant, an alkali metal silicate corrosion inhibitor and stabilizers to maintain the components in aqueous solution. The cleaner of the present invention contains no VOCs and is an effective and safe replacement for alcohol solvents previously used to clean solder paste from screens and stencils.

REFERENCES:
patent: Re35017 (1995-08-01), Winston et al.
patent: Re35045 (1995-10-01), Winston et al.
patent: Re35115 (1995-12-01), Winston et al.
patent: 5046415 (1991-09-01), Oates
patent: 5122200 (1992-06-01), Davis et al.
patent: 5234505 (1993-08-01), Winston et al.
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patent: 5261967 (1993-11-01), Winston et al.
patent: 5264046 (1993-11-01), Winston et al.
patent: 5264047 (1993-11-01), Winston et al.
patent: 5296041 (1994-03-01), Vinci et al.
patent: 5320756 (1994-06-01), Winston
patent: 5328522 (1994-07-01), Sowa et al.
patent: 5433885 (1995-07-01), Winston et al.
patent: 5558109 (1996-09-01), Cala et al.
patent: 5593504 (1997-01-01), Cala et al.
Prospects of Solder Paste Application in the Ultra Fine Pitch Era of Dr. Mancho Xiao, Kevin Lawless and Dr Ning-Chen Lee no date provided.
Critical Stencil Printing Parameters for Fine Pitch Technology of Scott Buttars no date provided.
Soldering in Electronics of R.J. Klein Wassinik no date provided.
Ensuring High-Yield BGA Assembly of Mark Ferguson, "Circuits Assembly", Feb. 1995.
An Overview of Manufacturing BGA Technology of Joel Mearig no date provided.
High Pin Count PBGA Assembly: Solder Defect Failure Modes and Root Cause Analysis of Suzanne Fauser, Cynthia Ramirez and Larry Hollinger no date provided.
Cleaning Systems for Low-Flashpoint Solvents of Barabara Kanegsberg, "PC", Mar. 1995.
The Future of Solder Paste Pringing for SMT Reflow Soldering of E.K. Lo, N.N. Ekere, S.H. Mannan and I. Ismail, Feb. 1993.
Metal Mask Stencils for Ultra Fine Pitch Printing of Mark Herbst, Aug. 29-Sep. 2, 1993.

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