Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
Reexamination Certificate
2011-08-30
2011-08-30
Deo, Duy-Vu N (Department: 1713)
Semiconductor device manufacturing: process
Chemical etching
Combined with the removal of material by nonchemical means
C438S691000, C438S692000, C438S693000, C051S307000, C051S308000, C051S309000
Reexamination Certificate
active
08008201
ABSTRACT:
Aqueous cerium oxide dispersion Aqueous cerium oxide dispersion, containing 5 to 60% by weight cerium oxide. It can be used to polish SiO2in the semiconductor industry.
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Japanese Office Action in JP 2008-505852. Mailed Dec. 17, 2010. English translation provided.
Heberer Stefan
Katusic Stipan
Krämer Michael
Kröll Michael
Lortz Wolfgang
Deo Duy-Vu N
Evonik Degussa GmbH
Smith , Gambrell & Russell, LLP
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