Aqueous based metal etchant

Details Aqueous based metal etchant Aqueous based metal etchant

2006-12-12

2006-12-12

Norton, Nadine (Department: 1765)

Compositions

Etching or brightening compositions

C252S079200, C438S745000, C438S754000

Reexamination Certificate

active

07147798

ABSTRACT:
The present invention provides an aluminum etchant solution for etching an aluminum surface in the presence of solder bumps. The etchant solution includes about 42% to about 80% phosphoric acid; about 0.1% to about 6% nitric acid; about 5% to about 40% acetic acid; about 0.005% to about 5% of an amine oxide surfactant; about 0.1% to about 8% of a Pb solubilizing additive; and about 5 to about 25% de-ionized water; wherein the solder bumps are substantially phosphate free after the etching. Also provided is a process for etching an exposed aluminum surface in a semiconductor structure in the presence of solder bumps including the steps of: contacting the exposed aluminum surface with the etchant solution; rinsing the semiconductor structure with de-ionized water; and drying the semiconductor structure to remove residual water; wherein the solder bumps are substantially phosphate free after the etching.

REFERENCES:
patent: 5972862 (1999-10-01), Torii et al.
International Search Report Application No. PCT/US04/26921, dated Apr. 19, 2006.

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