Aqueous alkaline bath for the chemical deposition of copper, nic

Details Aqueous alkaline bath for the chemical deposition of copper, nic Aqueous alkaline bath for the chemical deposition of copper, nic

1986-08-07

1988-01-19

Smith, John D.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

106 122, 106 123, 106 127, 4274431, C23C 1840

Patent

active

047204044

ABSTRACT:
An aqueous alkaline bath is disclosed, for the adhesive chemical (electroless) deposition of copper, nickel, cobalt or their alloys with great purity, containing compounds of these metals, reducing agent, wetting agent, pH-regulating substance, stabilizer, inhibitor and complex former, characterized in that polyols and/or compounds of the biuret type are contained as complex former, as well as a method for the adhesive chemical deposition of the metals, employing this bath at a temperature from 5.degree. C. up to the boiling point of the bath, particularly for the manufacture of printed circuits.

REFERENCES:
patent: 2430581 (1947-11-01), Pessel
patent: 2938805 (1960-05-01), Agens
patent: 3095309 (1963-06-01), Zeblisky
patent: 3383224 (1968-05-01), Dutkewych
patent: 3472660 (1969-10-01), Bastenbeck
patent: 3615735 (1971-10-01), Shipley

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