Approach for fabricating probe elements for probe card...

Details Approach for fabricating probe elements for probe card... Approach for fabricating probe elements for probe card...

2007-02-26

2009-12-29

Nguyen, Donghai D. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S831000, C029S884000, C324S754090

Reexamination Certificate

active

07637009

ABSTRACT:
An approach is provided for fabricating probe elements for probe card assemblies. Embodiments of the invention include using a reusable substrate, a reusable substrate with layered probe elements and a reusable substrate with a passive layer made of a material that does not adhere well to probe elements formed thereon. Examples of probe elements include, without limitation, a cantilever probe element, a vertically-oriented probe element, and portions of probe elements, e.g., a beam element of a cantilever probe element. Probe elements, or portions of probe elements, may be formed using any of a number of electroforming or plating processes such as, for example, plating using masking techniques, e.g., using lithographic techniques such as photolithography, stereolithography, X-ray lithography, etc.

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European Patent Office, “Notification of Transmittal of the International Search Report and the Written Opinion of the International Searching Authority, or the Declaration”, International application No. PCT/US2007/005144, dated Sep. 5, 2007, 11 pages.
Claims, International application No. PCT/US2007/005144, 3 pages.

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