Appratus for liquid thermosetting resin molding using radiofrequ

Details Appratus for liquid thermosetting resin molding using radiofrequ Appratus for liquid thermosetting resin molding using radiofrequ

1997-09-25

1998-12-01

Leung, Philip H.

Electric heating

Microwave heating

Load support

219697, 219746, 219756, 4251744E, H05B 680, H05B 670

Patent

active

058442170

ABSTRACT:
A method and apparatus for liquid thermoset resin or polymer molding using electromagnetic waves (particularly radiofrequency waves or microwaves), is described. The method and apparatus uses a metal mold (10, 212) with a cavity (401) for the molding as well as for confinement of the electromagnetic waves. Multiple low loss ports (A, B, C, D, E, p1, p2, p3) are provided for introducing the microwaves into the cavity.

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