Applying semiconductor laser mirror layers after securing suppor

Details Applying semiconductor laser mirror layers after securing suppor Applying semiconductor laser mirror layers after securing suppor

1996-09-30

1999-08-24

Chaudhuri, Olik

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Including integrally formed optical element

372107, 438 27, H01S 3025

Patent

active

059435534

ABSTRACT:
A method for manufacturing a semiconductor component having a semiconductor body secured to a support plate comprises securing the support plate on a surface of the semiconductor body before applying the cover layers which form mirrors on the end surfaces of the semiconductor body. The support plate is preferably made of an electrically and thermally conducting material which has a coefficient of thermal expansion similar to the coefficient of thermal expansion of the semiconductor body.

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