Metal fusion bonding – Process – With protecting of work or filler or applying flux
Patent
1994-11-30
1996-10-29
Bradley, P. Austin
Metal fusion bonding
Process
With protecting of work or filler or applying flux
228223, 228260, B23K 3536, B23K 3538, B23K 3102
Patent
active
055688942
ABSTRACT:
An arrangement of applying flux in solid, liquid or gaseous form directly to the solder wave avoids prefluxing of printed circuit boards or other elements to be soldered or solder wetted. The process for wave soldering an element comprises the steps of forming a solder wave above a solder reservoir, applying a flux directly to the solder wave separately from a shield gas delivery means to blanket the solder wave, and conveying the element through at least a portion of the solder wave. The process is applicable to wave soldering under a shroud wherein a gas shield is supplied by diffusers under the shroud, the flux being applied by at least one gas applicator directly to the solder wave.
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Metals Handbook, 9th Edition, vol. 6, ASM, Metals Park, OH, Aug. 1983, p. 8 .
Bradley P. Austin
Electrovert Ltd.
Knapp Jeffrey T.
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