Applying conductive lines to integrated circuits

Metal working – Method of mechanical manufacture – Electrical device making

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2940216, 29829, 156234, 174261, H05K 302

Patent

active

053218868

ABSTRACT:
A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

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