Applying conductive lines to integrated circuits

Details Applying conductive lines to integrated circuits Applying conductive lines to integrated circuits

1992-11-25

1994-03-01

Arbes, Carl J.

Metal working

Method of mechanical manufacture

Electrical device making

2940216, 29829, 156234, 174261, H05K 302

Patent

active

052896323

ABSTRACT:
A conductive line is applied to a substrate by aligning the conductive line in juxtaposition with a selected area of the substrate; bonding the conductive line to the substrate; and detaching the conductive line from a carrier in which the conductive line is suspended. The carrier has a carrier opening defined by sidewalls, and conductive material is suspended by the sidewalls of the carrier opening so as to be embedded within the carrier opening, and form the conductive line.

REFERENCES:
patent: 3614832 (1971-10-01), Chance
patent: 4418264 (1983-11-01), Thorwarth
patent: 4588468 (1986-05-01), McGinty
patent: 4630355 (1986-12-01), Johnson
patent: 4704304 (1987-11-01), Amendola
patent: 4859263 (1989-08-01), Dziurla et al.
patent: 4902364 (1990-02-01), Parker et al.
patent: 4908938 (1990-03-01), Thorwarth et al.
patent: 4970365 (1990-11-01), Chalco
patent: 5079070 (1992-01-01), Chalco

Affiliated with

Also associated with

Rating

Applying conductive lines to integrated circuits does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Applying conductive lines to integrated circuits, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Applying conductive lines to integrated circuits will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-569163