Applying apparatus

Details Applying apparatus Applying apparatus

1991-04-05

1993-05-18

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Surface bonding means and/or assembly means therefor

With cutting, punching, piercing, severing, or tearing

156552, 156555, 156556, 156559, B32B 3118, B32B 3120

Patent

active

052118002

ABSTRACT:
An applying apparatus, which cuts off a portion of a plurality of continuous films to a prescribed length and applies the cut-off portions of the films to a base plate, includes film feed members for feeding the continuous films to the base plate. The film feed members are provided above and below a base plate conveyance passage. A film feed member moving device moves the film feed members up and down synchronously at the right and left ends thereof relative to the base plate.

REFERENCES:
patent: 4659419 (1987-04-01), Miyake
patent: 4743325 (1988-05-01), Miyake
patent: 4842672 (1989-06-01), Matsuo et al.
patent: 4844772 (1989-07-01), Sumi et al.
patent: 4964937 (1990-10-01), Seki
patent: 4983248 (1991-01-01), Seki

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